TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery

TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery

Product descriptions

TIF500-40-11US Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Excellent thermal conductivity: 4.0W/mK
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
> Broad range of hardnesses available
> Moldability for complex parts

Applications

> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Product Specifications

Standard Thickness: 0.02" to 0.20" (0.50 to 5.00 mm) with increments of 0.01 (0.25 mm).

Standard Size: 8"X16"(203 mm×406 mm).
Component Codes:

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

TIF500-40-11US 4.0W/MK Insulation Gap Filler Silicone Pad Thermal Conductive Silicone Pad For CPU GPU EV Battery Images